22 January 2020

Amsterdam, Netherlands – January 21, 2020 –  Etiya, the leading Independent Software Vendor will showcase its 5G Intelligent Slicing Platform at Mobile World Congress 2020 in Barcelona, addressing its theme “Limitless Intelligent Connectivity”

The key features of Etiya’s 5G Intelligent Slicing Platform are:

-    Empowerment by Etiya’s Artificial Intelligence
-    “Plug and Play” Slice Creation
-    Enriched API Exposure  
-    Agile Monetization of Ecosystem
-    Faster Deployment and Time to Market

Etiya’s 5G Intelligent Slicing Platform enables operators to offer flexible, AI based slicing to monetize and manage their 5G ecosystem. It will allow service providers to generate additional revenue by offering Network as a Service Business Model, monetize tailored services agilely, deploy the services faster, and provide guaranteed quality of service levels. 

As the Platform is not dependent on existing BSS, there will be no need for extensive development work to integrate with Operators’ entire infrastructure to support tailored slicing. It is flexible to integrate with any orchestration layer and tenant ecosystem.

“Our 5G Intelligent Slicing Platform perfectly aligns with this year’s theme of MWC – Limitless Intelligent Connectivity” – said Aslan Dogan, CEO of Etiya – “Intelligence and Connectivity will become the conjoined twins of the future and 5G will empower the convergence of technologies and create limitless opportunities for Service Providers to offer the ultimate customer experience”

You can learn more about Etiya’s 5G Intelligent Slicing Platform at Stand (Hall 5 – 5I65) during Mobile World Congress taking place in Barcelona at Fira Gran Via on 24-27 February 2020.

Contact marketing@etiya.com to book a meeting with Etiya executives. 
 

Let us Share

Thank You!

You’ve been added to our mailing list. We’re happy to report that you will be among the first to hear